Molybdenum Copper Used as Microelectronic Material

molybdenum copper microelectronic material picture

Molybdenum copper, similar to tungsten copper, has the property of low thermal coefficient. Compared with tungsten thermal coefficient of 4.5x10-6/℃, molybdenum is 5.35 x10-6/℃. Copper owns high heat conductivity. Thus, molybdenum copper has properties of low thermal coefficient and high heat conductivity. The proportion of molybdenum and copper can be adjusted.

Following is a table to show molybdenum copper in different proportion.

 

thermal conductivity
W/(m﹒k)

Thermal coefficient
10-6/K

Density
g/cm3

Comparative Thermal 
Conductivity t W/(m﹒k)

WCu

140~210

5.6~8.3

15~17

9~13

MoCu

184~197

7.0~7.1

9.9~10.0

18~20

MoCu15

160

7.0

10

 

MoCu20

170

8.0

9.9

 

MoCu25

180

9.0

9.8

 

Mo

138

5.35

10.22

13.5

Cu

400

16.5

8.93

45

Molybdenum copper is widely used in integrated circuit, heat sink and thermal sink or other microelectronic material.